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With technological capabilities gained during the production of COB since our founding, the package boards for semiconductors account for more than 80percent of our total productions.
RYOWA has established a firm presence in the industry as a specialized package board maker and received a reliance from semiconductor assembly makers around the world.
These fine products are manufactured by creative human resources and in clean working environment.



SD Card board

SD CARD board


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 SD Card / Micro SD Card / Mini SD Card SD CARD


DDR-3 SDRAM board
(BOC : Board On Chip)
BOC


yajirusi

DDR-3 SDRAM Memory module

DDR-2 SDRAM

CSP bord
(CSP : Chip Size Package)
CSP


yajirusi

Cellular phone

CSP

Standard Specifications

Ultra-thin board

 Thickness t=30μ (limit thickness of rigid board)

Ultra-fine pitch

  1pitch   Line & Space
 Single-sided board 40μ 20μ + 20μ
 Double-sided board 50μ 25μ + 25μ
 Multi-layer board 60μ 30μ + 30μ