PRODUCTS
Since its founding, Ryowa has kept accumulating cutting-edge technologies for the production of COB boards.
Today boards for semiconductors account for more than 80 percent of all our products.
Ryowa is therefore a specialized semiconductor board maker, a rare presence in the industry, which enjoys overwhelming confidence of semiconductor assembly makers around the world.
Our superior products, which are hitting the global market one after another, are the fruits of our creativity and clean working environment.
Memory Card
RYOWA’s printed circuit boards are used in memory cards of smart phones, digital cameras and car navigation systems to record photos, music and data. Our technologies are progressing daily to enhance memory capacity, recording and reading speeds.
CSP・BOC
RYOWA’s CSP and BOC are used in control programs that operate many electronic hardware such as computers, home appliances and communication devices and also in IC packages that provide interim data storage. Our printed circuit boards may not be visible to users, but are working hard to serve our daily lives.
COB
COB is RYOWA’s technical basis. Our product developments have been evolving along with progresses of the electronic parts based on Chip-On-Board technologies such as miniaturized patterns, thinner boards, and gold plated surfaces. Our Chip-On Boards are contained in many different devices such as LED devices, sensors, precision measurement devices, watches and office devices.
PRODUCT SPECIFICATIONS
Finer patterns
L/S=25/25
L/S=35/35
Spec
- Minimal lines and space
- 25um/25um
Thinner boards
Finished thickness:110um
Finished thickness:90um
Finished thickness:140um
Spec
Minimum 90 nm for double layer board/Minimum 140 um for four layer board
STANDARD
- 2Layer:Total thickness t=90μm
- 4Layer:Total thickness t=130μm
- Double-sided board 1pitch 50μm
- Line&Space 25μm / 25μm
Your inquiries about specifications and any other concerns are appreciated.